Discover the CMP and grinding solutions optical measuring technology offers in this whitepaper

After over a decade of close partnerships with leading machine builders in the semiconductor industry, we know full well what the requirements for a stable chemical mechanical polishing (CMP) and grinding process are.

Non-contact, non-destructive optical measuring technology can precisely monitor and control wafer thickness during grinding. Large amounts of sludge can be handled by customized water-jet probes to guarantee an optimum measurement performance.

Further information about our solution for the semiconductor industry can be found in this “CMP and Grinding” whitepaper. Additional highlights include:

Tactile vs. optical measuring

Challenges in CMP and grinding

 Our solution for a stable process in a shorter processing time 

Download this whitepaper for your own benefit now.